Coating Materials / Abbreviation
| Material |
Abbreviation |
| Pure Tin |
Sn |
100 |
| Tin-Lead Alloy |
L5
L40
L70 |
SnB 95/05
SnB 60/40
SnB 30/70 |
| Nickel |
Ni |
|
| Silver |
Ag |
|
Layer Combinations / Standard
| Combination |
Underlayer |
Top Layer |
| I |
hot-tin-dipped |
electroplated with tin |
| II |
electroplated with nickel |
hot-tin-dipped |
| III |
electroplated with nickel |
electroplated with tin |
A special version of a multiple layer configuration is represented by the Edelhoff DC Quality, which has been developed with
regard to a whisker reduced pure tin coating. DC-type wires provide a well developed Intermetallic Phase between copper and tin.
Layer Thickness / Thickness Tolerance Range
| Diameter Range |
Layer Thickness |
Electroplating |
Hot-Tin-Dipping |
| |
min. max. |
GDV |
FOV |
FDV |
| [mm] |
[µm] |
[µm] |
[µm] |
[µm] |
| < 0,50 |
GDV: 2-4
FDV: 2-8 |
2 |
- |
-
6 |
| 0,50-0,80 |
2 - 20 |
2 |
4 |
6 |
| 0,80-1,50 |
2-20 |
2 |
- |
6 |
Deviations from the above may occur.
Tinning Classes
| Average Tin Layer Thickness |
| Class |
0,05...0,14 mm |
0,15...0,29 mm |
0,30...1,00 mm |
| V1 |
No Requirement |
| V2 |
>0,4 µm |
>0,6 µm |
>0,8 µm |
| V3 |
>1,0 µm |
>1,5 µm |
>2,0 µm |
| V4 |
>3,0 µm |
>3,0 µm |
>3,0 µm |
V5
min. Value |
- |
6 µm ± 3 µm
1,5 µm |
6 µm ± 3 µm
1,5 µm |
Solderability
Basic Standards:
DIN IEC 68 Part 2-20
MIL-STD 202 E
BS 2011
Testing after Ageing:
up to 72 hours at 155°C or steam ageing or to individual requirements.
Packaging Range
Diameter Range: 0,05 - 2,5 mm,
Coating Materials: Sn, Sn/Pb-Alloy, Nickel, Silver,
Core Materials: non-ferrous metals, steel, copper-cladded steel (CCS).
Other options are available upon request.
Fields of Application
The assembly of electronic components is basically performed by using various types of solder processes. Therefore, reliable and
durable solder joints are the basic requirement for the installation of electronic devices. In today's nearly fully automated
production lines both the component manufacturers as well as their customers expect trouble-free processing of lead-out
wires and components produced therefrom. Despite existing standards, Feindrahtwerk Adolf Edelhoff are dedicated to individual
developments with each customer and are in a position to offer real problem solving solutions. A choice of coating
technologies, variable layer configuration and a high number of available core materials enable us, always to answer our
customers' requests with a technically and commercially viable solution e.g.
- Resistors,
- Capacitors,
- Coil Bodies,
- Jumper Wires,
- Diodes,
- Oscillating Crystals,
- Inductors,
- Voltage Suppression,
- Varistors.
