High-Performance
Wire platings

Innovation since 1760

Finishing expertise
at the highest level

Your reliable partner for customized
high performance wire platings

We are your partner for the development and production of the most sophisticated specialty wire solutions in high-tech industries
Our galvanized and hot-dip tinned wire solutions are as specific as your requirements
We are also happy to offer you small series and contract plating
Our philosophy includes continuous innovation, sustainable processes and maximum quality standards

Geometries

Round wire ⌀ 0,028 – 3,00 mm

Profile wire up to 3,00 mm²

Flat wire up to 5,95 mm width

Precision thanks to our own laboratory capacities:
Your quality in best hands

Quality assurance and laboratory equipment state-of-the-art technology

In-house analytical laboratory
Equipped with the latest technology such as ICP and HPLC for precise and fast analysis of electroplating electrolytes.
State-of-the-art metallography laboratory
With digital high-performance microscopes, X-ray analysis and other advanced measuring systems for comprehensive quality assurance.
Innovative electroplating laboratory
Specialized in electroplating tests and the development of advanced platings.

Core materials

Copper

X

Copper is mainly used in the wire sector due to its excellent electrical and thermal conductivity. It enables efficient current transmission with minimal energy loss, making it ideal for applications in electronics, power supply and communication. Copper is also corrosion-resistant, mechanically robust and easy to process (e.g. drawing), making it a preferred material for wires and cables.
PDF data sheet
Steel / Iron

X

In the electronics sector, steel/iron is mainly used as a core material in conductors or shielding, often with platings such as copper, nickel or tin to improve electrical conductivity and corrosion resistance. It is used, for example, in shielding wires, magnetic components or mechanically stressed connections. The high tensile strength of steel is an advantage for robust electronic applications.
PDF data sheet
Copper alloys

X

Copper alloys are used to improve properties such as strength, corrosion resistance and temperature stability. Alloys such as copper-beryllium, bronze, brass and other alloys offer a good balance between mechanical robustness and electrical conductivity, which is why they are used in spring contacts, high-current cables or aggressive environments. They are ideal when pure copper is not mechanically or thermally sufficient.
PDF data sheet
Stainless steel wires

X

Electroplated stainless steel wires are used to make the surface electrically conductive and improve solderability, as stainless steel has a naturally low conductivity. Platings such as copper, nickel or tin ensure a better electrical connection and at the same time protect against corrosion. This combination is ideal for applications in aggressive environments or for long-lasting electrical contacts. Thanks to their robustness and stability, they are ideal for durable, resilient connections in demanding applications.
PDF data sheet
Nickel

X

Pure nickel is used due to its excellent corrosion resistance, good electrical conductivity and high temperature resistance. It is particularly suitable for applications in chemically aggressive or hot environments, such as heating elements, thermocouples or cables in the chemical industry. Nickel is also used as a base for electroplated platings or as resistance wire.
PDF data sheet
Composite materials

X

Composite materials such as CCS (Copper Cladded Steel) and CCA (Copper Cladded Aluminium) combine mechanical stability with good electrical conductivity. Thanks to the high tensile strength of the steel and the conductivity of the copper, CCS is ideal for mechanically stressed wires that need to have low resistance. CCA offers low weight thanks to aluminum and at the same time improved conductivity due to copper, which makes it ideal for lightweight power cables, especially in the aviation and automotive industries. Both materials are economical alternatives to pure copper in demanding applications. We also offer CCS37E, a material with a stainless steel core, for extreme mechanical stress and high conductivity.
PDF data sheet
Nickel alloys

X

Nickel alloys are used to increase corrosion resistance, heat resistance and mechanical stability. They offer good electrical conductivity and are ideal for applications in extreme environments, such as high-temperature or chemically aggressive areas. Examples are nickel-chromium wires for heating elements or nickel-copper wires for maritime applications.
PDF data sheet
Special alloys

X
PDF data sheet
Superconductor

X

Metallic superconductors for contract plating
Shape memory alloy (Nitinol)

X

Specific Applications: Actuators, Sensors, Superelasticity (or Pseudoelasticity)
Other plateable base materials on request

X

Aluminium: good conductivity, low weight

Plating materials

Discover versatile materials for customized platings.

Tin

X

Tin is mainly used in electroplating as corrosion protection and for solderability. It protects metals such as steel, copper or brass from oxidation and is often used in electronics, e.g. for printed circuit boards or electrical (plug-in) contacts. Tin platings are also non-toxic and environmentally friendly.

Matt tin plating has a rough, non-reflective surface that is particularly suitable for applications with high soldering requirements, as it enables excellent wetting.
Tin melted

X

Tin is mainly used in electroplating as corrosion protection and for solderability. It protects metals such as steel, copper or brass from oxidation and is often used in electronics, e.g. for printed circuit boards or electrical (plug-in) contacts. Tin platings are also non-toxic and environmentally friendly.

The advantage of a matt, melted tin layer lies in its homogeneous and oxide-free surface, which ensures excellent solderability. Melting also eliminates possible micro-cavities or stresses in the layer. The surface is shiny after melting.
Bright Tin

X

Tin is mainly used in electroplating as corrosion protection and for solderability. It protects metals such as steel, copper or brass from oxidation and is often used in electronics, e.g. for printed circuit boards or electrical (plug-in) contacts. Tin platings are also non-toxic and environmentally friendly.

Bright tin-plated contacts are characterized by a smooth, reflective surface that offers very good solderability and corrosion resistance.
Tin/Lead

X

Tin/lead is used in electroplating, particularly in the aerospace industry, as it offers excellent solderability and prevents the formation of tin whiskers. The alloy is chemically resistant and stable at high temperatures, which is why it is also suitable for critical applications in aggressive environments.
Tin/Indium

X

Low-melting solders in the wire area enable soldering at low temperatures, which is particularly gentle on sensitive components and PCBs. They often contain metals such as tin, lead, bismuth or indium and are ideal for applications where temperature limits must be maintained. This reduces the risk of heat damage and deformation.
Tin/Bismuth

X

Low-melting solders in the wire area enable soldering at low temperatures, which is particularly gentle on sensitive components and PCBs. They often contain metals such as tin, lead, bismuth or indium and are ideal for applications where temperature limits must be maintained. This reduces the risk of heat damage and deformation.
Tin/Bismuth/Silver

X

Low-melting solders in the wire area enable soldering at low temperatures, which is particularly gentle on sensitive components and PCBs. They often contain metals such as tin, lead, bismuth or indium and are ideal for applications where temperature limits must be maintained. This reduces the risk of heat damage and deformation.
Tin hot-dip tinned (Sn and SnPb)

X

Hot-dip tinning produces a more robust tin layer, which is particularly suitable for mechanically resilient and corrosion-resistant wires but is less uniform and often has a slightly lower soldering quality.
Nickel

X

Nickel is used in electroplating on wires as corrosion protection and a diffusion barrier. As a final layer, it prevents materials such as copper from migrating through and ensures a durable, resistant surface. It is also often used as an intermediate layer to improve the adhesion of other platings such as tin or gold.
Copper

X

Electroplated copper thick platings serve primarily as a conductive layer. It offers excellent electrical conductivity and often serves as an intermediate layer to improve the adhesion of nickel, tin or gold. It also protects the wire as a final layer against oxidation and mechanical wear.
Silver

X

Silver is used because of its excellent electrical conductivity and good oxidation resistance. It improves electrical performance and is often used for high-frequency applications or in electronics. It also provides a durable, solder-friendly surface, ideal for plug contacts and connecting elements.
Hard Gold

X

Hard gold is used to create an extremely durable and conductive surface. It offers excellent corrosion and wear resistance as well as high electrical conductivity, making it ideal for highly stressed contacts and applications in electronics. The addition of cobalt increases the hardness and abrasion resistance compared to pure gold. Classification according to ASTM Type I-II, Grade C-D
Fine Gold

X

Fine gold is used on wires to create an extremely corrosion-resistant, highly conductive and also drawable surface. It is particularly suitable for sensitive electronic applications as it offers excellent contact quality and does not oxidize or lose conductivity. Due to its softness, fine gold is mainly used for applications where no high mechanical loads occur. Classification according to ASTM Type III, Grade A
Palladium

X

Application as intermediate layer substitute for nickel
Iron
Special platings

X

Tin-silver: special plating for whisker protection and plating for superconductors
Ruthenium: special plating
Other platings on request

Packaging reels and containers

PDF data sheet

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weight [ca. kg]	Preferred qualities
B300P (Cardboard)	320	200	-	230	190	-	0,900	19	Ø 0,40 – Ø 1,00 mm; a + b
K 310/230 (Plastic)	310	195	-	230	140	-	3,100	19	Ø 0,40 – Ø 1,00 mm; a + b
K 500/150 (Plastic)	500	330	-	150	150	-	2,520	40	Ø 0,60 – Ø 1,50 mm; a + b
M 500/400 (Cardboard)	500	320	-	400	400	-	6,750	100	Ø 0,80 – Ø 2,50 mm; a + b
Octabin (Cardboard)	900	465	-	1020	980	-	22,000	1000	Ø 1,00 – Ø 2,50 mm; b

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weigh [ca. kg]	Preferred qualities
Alu 250	250	150	127	190	150	60	5,00	22	Ø 0,10 – Ø 0,50 mm; c
Alu 400	400	250	127	300	250	60	17,40	110	Ø 0,40 – Ø 1,00 mm; c
E 500	500	280	127	380	315	10	43,00	220	Ø 0,40 – Ø 1,00 mm; c

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weight [ca. kg]	Preferred qualities
K SD 300 D	300	212	51,5	103	91	-	0,700	12	Ø 0,20 – Ø 1,00 mm; a + b + c
K SH 390 H	390	310	305	89	79	-	0,600	15	Ø 0,20 – Ø 1,00 mm; a + b + c

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weight [ca. kg]	Preferred qualities
K63	63	40	11	63	49	-	0,042	0,5	Ø 0,05 – Ø 0,50 mm; a + b + c
K63 + Dose	-	-	-	-	-	-	0,068	0,5	Ø 0,05 – Ø 0,50 mm; a + b + c
K80	80	50	16	80	64	-	0,070	1	Ø 0,05 – Ø 0,50 mm; a + b + c
K80 + Dose	-	-	-	-	-	-	0,120	1	Ø 0,05 – Ø 0,50 mm; a + b + c
K100	100	63	16	100	80	-	0,130	2	Ø 0,10 – Ø 0,80 mm; a + b + c
K 125	125	80	16	125	100	60	0,200	3	Ø 0,10 – Ø 0,80 mm; a + b + c
K 160	160	100	22	160	128	60	0,350	7	Ø 0,20 – Ø 1,00 mm; a + b + c
K 200	200	125	22	200	160	60	0,600	12	Ø 0,30 – Ø 1,00 mm; a + b + c
K 250	250	160	22	200	160	60	1,050	22	Ø 0,40 – Ø 1,20 mm; a + b + c
K 250Z	250	160	127	200	160	60	2,500	22	Ø 0,30 – Ø 1,00 mm; b + c
K 355	355	224	36	200	160	60	1,900	40	Ø 0,50 – Ø 1,50 mm; a + b + c
K355/344/B127	355	224	127	344	310	45	3,200	80	Ø 0,50 – Ø 1,50 mm; a + b + c
K500	500	315	36	250	180	-	7,650	90	Ø 0,50 – Ø 1,50 mm; a + b + c
K560	560	355	127	356	280	-	-	200	Ø 0,50 – Ø 1,50 mm, Vierkant- u. Flachdrähte / Square- and flat wire; a + b + c

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weight [ca. kg]	Preferred qualities
K 250/400	250	150	100	400	335	-	2,25	40	Ø 0,50 – Ø 1,00 mm; a + b
K 315/500	315	190	100	500	425	-	4,35	80	Ø 0,50 – Ø 1,20 mm; a + b

Product:
a = Hot-dip tinning
b = Galvanic plating
c = Bare wire
Other combinations are of course possible

Types of packaging:
In addition to the usual standard packaging (mesh box and Euro pallet), we offer special packaging specially developed for the transportation of component connecting wires.
special packaging. Our Technical Service will be happy to advise you on this.

Type	d₁ [mm]	d₂ [mm]	d₃ [mm]	L₁ [mm]	L₂ [mm]	α [1 °]	Weight [kg]	Filling weight [ca. kg]	Preferred qualities
HK 100	100	75	59	160	91	21	0,35	2	Ø 0,05 – Ø 0,20 mm; b + c
HK 130	130	99	81,7	176	91	21	0,6	3	Ø 0,05 – Ø 0,20 mm; b + c

Wire modifications

Our range of services includes a variety of wire modifications, including galvanic processes, hot-dip tinning and specialized annealing processes.
specialized annealing processes. With a focus on quality assurance, we offer you customized solutions.

Electroplating

Single layer
Multi-layer

Hot-dip tinning

Thin hot-dip tinned
Thick hot-dip tinned
Concentric hot-dip tinning

Annealing

Various annealing
processes in use

Reflow

Round wire
Profile wire
Flat wire

Knurling

2-sided
4-sided

Tarnish protection

For Ag plating
For Cu plating
For Sn plating

Temperature resistance

Discoloration protection for tin-plated surfaces and at high temperatures

Applied standards

The production, testing and measurement of our finished products follow the global
specifications of DIN, MIL and ASTM standards.
Here you will find a detailed overview of the applied standards.